会议论文详细信息
2018 3rd International Conference on Advanced Materials Research and Manufacturing Technologies
Study on the Influence of Process Parameters on Interface Strength of Film-insert Molding
材料科学;机械制造
Hu, Zhangyong^1,2 ; Zhang, Annan^1 ; Wang, Zhiyong^1 ; Li, Yang^1
State Key Laboratory of Material Processing and Die and Mold Technology, Huazhong University of Science and Technology, Wuhan
430074, China^1
Huanggang Normal University, College of Mechanical and Electrical Engineering, Huanggang City, HuangGang
438000, China^2
关键词: Film insert moldings;    Influence of process parameters;    Interface structures;    Interfacial bonding strength;    Numerical simulation method;    Processing parameters;    Temperature changes;    Thermal characterization;   
Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/436/1/012023/pdf
DOI  :  10.1088/1757-899X/436/1/012023
学科分类:材料科学(综合)
来源: IOP
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【 摘 要 】

By the controlling of variable, the influences on the film interface strength that filmline molding process had were investigated. The interfacial bonding strength under the circumstance where various of processing parameters (temperature, film thickness, injecting speed) were combined was measured through a normalized 90° peel test. And we used Superhigh magnification lens zoom 3D microscope to observe the Interface structure around the interface and the section of interface was observed too. To profoundly study the interfacial bonding strength mechanism, using the numerical simulation method, we analysed the temperature changes of the interface. And the crystallinities in different processing parameters combination situations were monitored by thermal characterization DSC. And then we calculated the crystallinities of the melt at the interface, drawing a conclusion about the relations between crystallinity and interface strength. The results show that the process conditions are favorable for improving the crystallinity of the interface and have obvious effects on the strength of the interface.

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