Thermal Optimization of Heat Sink for Inverter Applications

2nd International Conference on Engineering for Sustainable World

Onoroh, F.^1 ; Ogbonnaya, M.^1 ; Chukuneke, J.L.^2 ; Echeta, C.B.^2

Department of Mechanical Engineering, University of Lagos, Akoka, Lagos state Yaba, Nigeria^1

Department of Mechanical Engineering, Nnamdi Azikiwe University, Anambra state Awka, Nigeria^2

关键词: Inverter application;    MOSFET chips;    Power inverters;    Renewable energies;    Renewable energy technologies;    Switching operations;    Thermal optimization;    Thermoelectric energy;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/413/1/012058/pdf
DOI  :  10.1088/1757-899X/413/1/012058

来源: IOP

【 摘 要 】

Power inverters enable efficient conversion of DC voltage and current to AC voltage and current and are intermediate device in renewable energy technology application especially solar, wind and thermoelectric energy. The key technologies behind power inverters switching operation are the semiconductor devices such as the IRF 3205 MOSFET chip. During operation the switches dissipate heat and if the dissipated heat is not properly managed, thermally induced failure may occur. The research work involves generation of a heat sink model and its optimization for a 24VDC/2.5K.V.A inverter. The thermal resistance, fval, of the optimized heat sink was found to be equal to 0.0345 °C/W which is less than the thermal resistance of the heat sink to ambient of the IRF 3205 MOSFET switch of 0.5063 °C/W. The thermal management of the power inverter package yields experimental and modeled package temperatures of 34.7°C and 36.5°C respectively. The optimized heat sink using the model created leads to reduction in size, weight and reliable operation of the power inverter.