Study on novel silicon-containing dipropargyl ethers

6th Annual International Conference on Material Science and Engineering

Dong, Sikun^1 ; Yuan, Qiaolong^1 ; Xu, Qian^1 ; Huang, Farong^1

Key Laboratory of Specially Functional Polymeric Materials and Related Technology, Ministry of Education, School of Materials and Engineering, East China University of Science and Technology, 200237, China^1

关键词: Cure reactions;    Cure shrinkage;    Finish temperature;    Grignard reaction;    High thermal stability;    Initial temperatures;    Peak temperatures;    Processing problems;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/397/1/012007/pdf
DOI  :  10.1088/1757-899X/397/1/012007

来源: IOP

【 摘 要 】

The silicon-containing dipropargyl ether (SDE) is a novel class of thermosetting resins with many fascinating advantages such as high thermal stability and ablative resistance. But it also suffers from some shortcomings such as low mechanical properties of cured resin. To improve the mechanical properties and some processing problems of it, three different structural SDE were synthesized by Grignard reaction. The solubility, cure shrinkage rate, cure reaction, thermal properties and mechanical properties were studied. The results indicate that the SDE resins are dissolved in most organic solvents. The cure shrinkage rate of SDE resins are no more than 1.5%. The initial temperature (Ti), peak temperature (Tp) and finish temperature (Tf) are more than 230°C, 280°C and 310°C. The temperature at 5% mass loss (Td5) and residual yield at 800°C (Yr 800°C) in nitrogen are over 410°C and 68%. Flexural strength of resins is over 12 MPa. The SDE resin is promising to be an excellent thermosetting resin.