Influence of the technological development on the adhesion increment of metallic thin film coatings to ceramic substrates of aluminum oxide

25th International Conference on Vacuum Technique and Technology

Kolesnik, L.L.^1 ; Kyaw Hlaing, Myo^1 ; Phyo Aung, Zaw^1

Bauman Moscow State Technical University, Russia^1

关键词: Ceramic substrates;    Current layers;    Direct-current magnetrons;    Metallic thin films;    Minimum distance;    Pulse magnetron;    Substrate positions;    Technological development;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/387/1/012037/pdf
DOI  :  10.1088/1757-899X/387/1/012037

来源: IOP

【 摘 要 】

In this journal are considered that the comparing of the adhesion strength with and without Ti layer between substrate and current layers. Comparing of the DC magnetron and pulse magnetron with various pressure in vacuum chamber. With Ti sub layer adhesion strength 10 times more than without adhesion layers. The best value of adhesion strength was obtained by using with a direct current magnetron and pressure in the chamber 8.8×10-2 mbar. A series of experiments was conducted with differences substrate position and maximum and minimum distance between substrate and target to prevent the destruction of the substrate when coating with a hot cathode target, it is necessary to limit the thermal effect on it.