Effect of Copper Ion Concentration on Microstructure and Mechanical Properties of Electrolytic Copper Foil

4th Annual International Workshop on Materials Science and Engineering

Li, Yanfeng^1 ; Huang, Guojie^1 ; Yin, Xiangqian^1 ; Chen, Xi^1 ; Ma, Xiuling^2 ; Li, Yongzhen^2 ; Yao, Endong^2

State Key Laboratory of Nonferrous Metals and Processes, GRIMAT Engineering Institute Co. Ltd, Beijing

101407, China^1

Qinghai Electronic Material Industry Development Co. Ltd, Xining, 810006, China^2

关键词: Constant conditions;    Effect of coppers;    Electrolytic process;    Fracture mechanisms;    Microstructure and mechanical properties;    Rate increase;    Strength and elongations;    Universal testing machines;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/381/1/012166/pdf
DOI  :  10.1088/1757-899X/381/1/012166

来源: IOP

【 摘 要 】

Under the constant condition of controlling the relative electrolytic process parameters, the electrolytic copper foil with 12 μm thickness was prepared by adjusting the time of electrode position under the conditions of different copper ion concentration. The surface morphology, mechanical properties and texture of electrolytic copper foil under different current density were studied by SEM, XRD, EBSD and universal testing machine. The fracture mechanism of copper foil at different current density was analyzed. The results show that when the copper ion concentration is 84g/L, the particles on the copper foil surface are uniform and fine, and the mechanical properties are the best. With the increase of copper ion concentration, the electrode position rate increases, the particle size of copper foil increases, and the tensile strength and elongation of copper foil decrease. The copper ion concentration has little effect on the texture of copper foil.