Numerical Studies For Charging And Discharging Characteristics Of Composite Phase Change Material In A Deep And Shallow Rectangular Enclosure

International Conference on Advances in Manufacturing, Materials and Energy Engineering 2018

材料科学;能源学

Chavan, Santosh^1 ; Arumuga Perumal, D.^1 ; Gumtapure, Veershetty^1

Department of Mechanical Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore

575025, India^1

关键词: Composite phase change materials;    Convection currents;    Copper nanoparticles;    Discharging characteristics;    Heat Transfer enhancement;    Interface morphologies;    Melting heat transfer;    Rectangular enclosures;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/376/1/012059/pdf
DOI  :  10.1088/1757-899X/376/1/012059

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

In this study, a numerical analysis of the melting process with natural convection in a rectangular enclosure has been performed using enthalpy porosity model. A Composite phase change material (Paraffin wax (98%) is used as base material and copper nanoparticles (2%) as additives) is used. The enclosure is heated from one side and opposite side is isothermal at 300 K, and remaining walls are thermally insulated. Melting heat transfer in a rectangular enclosure with different orientations are investigated numerically. The flow field results in nonuniform melting of the composite phase change material (CPCM). The interface morphology is used to infer flow structure and the extent of two-dimensional energy transport. These flow patterns are found to be dependent on the orientation and the initial CPCM sub-cooling. The results reveal that the enclosure orientation has a significant effect on the formation of natural convection currents and consequently on the heat transfer rate and melting time of the CPCM. As the orientation changed from deep to shallow, the convection currents in the enclosure, increases and chaotic flow structure appear. Hence, it can be concluded that the heat transfer enhancement ratio for the deep enclosure is more than that of the shallow enclosure.