Effects of Thermal Resistance on One-Dimensional Thermal Analysis of the Epidermal Flexible Electronic Devices Integrated with Human Skin

1st International Conference on Frontiers of Materials Synthesis and Processing

材料科学;化学

Li, He^1 ; Cui, Yun^1

Institute of Solid Mechanics, Beihang University, Beijing

100191, China^1

关键词: Bioheat transfer equations;    Contact thermal resistance;    Direct contact;    Flexible electronic devices;    Fourier heat conduction;    One-dimensional heat;    Provide guidances;    Temperature increase;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/274/1/012023/pdf
DOI  :  10.1088/1757-899X/274/1/012023

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

Nowadays, flexible electronic devices are increasingly used in direct contact with human skin to monitor the real-time health of human body. Based on the Fourier heat conduction equation and Pennes bio-heat transfer equation, this paper deduces the analytical solutions of one-dimensional heat transfer for flexible electronic devices integrated with human skin under the condition of a constant power. The influence of contact thermal resistance between devices and skin is considered as well. The corresponding finite element model is established to verify the correctness of analytical solutions. The results show that the finite element analysis agrees well with the analytical solution. With bigger thermal resistance, temperature increase of skin surface will decrease. This result can provide guidance for the design of flexible electronic devices to reduce the negative impact that exceeding temperature leave on human skin.