Effect of surface etching and electrodeposition of copper on nitinol

International Materials Research Meeting in the Greater Region: "Current Trends in the Characterisation of Materials and Surface Modification"

Ramos-Moore, E.^1,2 ; Rosenkranz, A.^1,2 ; Matamala, L.F.^3 ; Videla, A.^3,4 ; Durán, A.^4 ; Ramos-Grez, J.^2,5

Instituto de Física, Pontificia Universidad Católica de Chile, Santiago

7820436, Chile^1

Centro de Investigación en Nanotecnología y Materiales Avanzados 'CIEN-UC', Pontificia Universidad Católica de Chile, Santiago, Chile^2

Departamento de Ingeniería en Minas, Pontificia Universidad Católica de Chile, Santiago, Chile^3

Departamento de Ingeniería Metalúrgica, Universidad de Santiago de Chile, Avda. Libertador Bernardo O'Higgins 3363, Casilla, Santiago, RM

10233, Chile^4

Departamento de Ingeniería Mecánica y Metalúrgica, Pontificia Universidad Católica de Chile, Santiago, Chile^5

关键词: Antibacterial properties;    Coating deposition;    Copper coatings;    Copper interface;    Dental applications;    Electrodeposited copper;    Surface etching;    Thermal techniques;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/258/1/012009/pdf
DOI  :  10.1088/1757-899X/258/1/012009

来源: IOP

【 摘 要 】

Nitinol-based materials are very promising for medical and dental applications since those materials can combine shape memory, corrosion resistance, biocompatibility and antibacterial properties. In particular, surface modifications and coating deposition can be used to tailor and to unify those properties. We report preliminary results on the study of the effect of surface etching and electrodeposition of Copper on Nitinol using optical, chemical and thermal techniques. The results show that surface etching enhances the surface roughness of Nitinol, induces the formation of Copper-based compounds at the Nitinol-Copper interface, reduces the austenitic-martensitic transformations enthalpies and reduces the Copper coating roughness. Further studies are needed in order to highlight the influence of the electrodeposited Copper on the memory shape properties of NiTi.