Research on burnout fault of moulded case circuit breaker based on finite element simulation

2017 2nd International Seminar on Advances in Materials Science and Engineering

Xue, Yang^1 ; Chang, Shuai^2 ; Zhang, Penghe^1 ; Xu, Yinghui^1 ; Peng, Chuning^3 ; Shi, Erwei^1

Metrology Center, China Electric Power Research Institute, Beijing

100192, China^1

Beijing Key Laboratory of High Voltage, EMC, North China Electric Power University, Beijing

102206, China^2

State Grid Corporation of China, Beijing

100031, China^3

关键词: Failure events;    Finite element simulations;    Live wire;    Molded case circuit breakers;    Multi-physics;    Steady state and transients;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/231/1/012036/pdf
DOI  :  10.1088/1757-899X/231/1/012036

来源: IOP

【 摘 要 】

In the failure event of molded case circuit breaker, overheating of the molded case near the wiring terminal has a very important proportion. The burnout fault has become an important factor restricting the development of molded case circuit breaker. This paper uses the finite element simulation software to establish the model of molded case circuit breaker by coupling multi-physics field. This model can simulate the operation and study the law of the temperature distribution. The simulation results show that the temperature near the wiring terminal, especially the incoming side of the live wire, of the molded case circuit breaker is much higher than that of the other areas. The steady-state and transient simulation results show that the temperature at the wiring terminals is abnormally increased by increasing the contact resistance of the wiring terminals. This is consistent with the frequent occurrence of burnout of the molded case in this area. Therefore, this paper holds that the burnout failure of the molded case circuit breaker is mainly caused by the abnormal increase of the contact resistance of the wiring terminal.