Synthesis and Characterization of TiO2/SiO2 Thin Film via Sol-Gel Method

International Conference on Innovative Research - ICIR Euroinvent 2017

Halin, D.S.C.^1 ; Abdullah, M.M.A.B.^1,2 ; Mahmed, N.^1 ; Abdul Malek, S.N.A.^1 ; Vizureanu, P.^1,4 ; Azhari, A.W.^3

Center of Excellence Geopolymer and Green Technology (CEGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis, (UniMAP), Perlis, Malaysia^1

Faculty of Engineering Technology, Universiti Malaysia Perlis, (UniMAP), Perlis, Malaysia^2

School of Environmental Engineering, Universiti Malaysia Perlis, (UniMAP), Perlis, Malaysia^3

Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Iasi, Romania^4

关键词: Annealing temperatures;    Crack free;    Crystalline phase;    Drying process;    Sol-gel spin coating method;    Synthesis and characterizations;    TiO2/SiO2;    UV-vis spectroscopy;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/209/1/012002/pdf
DOI  :  10.1088/1757-899X/209/1/012002

来源: IOP

【 摘 要 】

TiO2/SiO2thin films were prepared by sol-gel spin coating method. Structural, surface morphology and optical properties were investigated for different annealing temperatures at 300°C, 400°C and 500°C. X-ray diffraction pattern show that brookite TiO2crystalline phase with SiO2phase presence at 300°C. At higher temperatures of 400-500°C, the only phase presence was brookite. The surface morphology of film was characterized by scanning electron microscopy (SEM). The films annealed at 300°C shows an agglomeration of small flaky with crack free. When the temperature of annealing increase to 400-500°C, the films with large flaky and large cracks film were formed which was due to surface tension between the film and the air during the drying process. The UV-Vis spectroscopy shows that the film exhibits a low transmittance around 30% which was due to the substrate is inhomogeneously covered by the films. In order to improve the coverage of the film on the substrate, it has to repeatable the spin coating to ensure the substrate is fully covered by the films.