Formation of a diffusion-based intermetallic interface layer in friction stir welded dissimilar Al-Cu lap joints

19th Chemnitz Seminar on Materials Engineering – 19. Werkstofftechnisches Kolloquium

Marstatt, R.^1 ; Krutzlinger, M.^2 ; Luderschmid, J.^1 ; Zaeh, M.F.^2 ; Haider, F.^1

Department for Experimental Physics 1, University of Augsburg, Universitaetsstr. 1, Augsburg

86159, Germany^1

Institute for Machine Tools and Industrial Management (Iwb), Technical University of Munich, Boltzmannstr. 15, Garching

85748, Germany^2

关键词: Elevated temperature;    Friction stir welding(FSW);    Intermetallic interface;    Intermetallic layer;    Intermetallic phasis;    Process temperature;    Scanning transmission electron microscopy;    Solidus temperature;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/181/1/012002/pdf
DOI  :  10.1088/1757-899X/181/1/012002

来源: IOP

【 摘 要 】

The joining of dissimilar metals is an important issue in modern lightweight design. Friction Stir Welding (FSW) is suitable for this task since the solidus temperature is usually not exceeded during the process. As a consequence, dissimilar joints can be produced with a minimum of deteriorating intermetallic phases. The latest studies showed the formation of intermetallic layers at the bonding interface with no significant negative influence on the seam quality. In this study, those intermetallic nanolayers at the interface of aluminium / copper lap joints were analysed. For the experiments, the commercially pure alloys EN AW-1050 and CW008A were chosen. The process temperature changed with respect to the parameter setup and was measured at different locations of the seam. The intermetallic layers at the interface were analysed by scanning electron microscopy (SEM) and scanning transmission electron microscopy (STEM). The experiments show that the thickness of the interlayer clearly correlates with the process temperature using an Arrhenius equation. It is supposed, that the rotating probe removes the oxide layers of the metal surfaces and a metallic bonding between the Al- and the Cu-phase is formed. Due to the elevated temperature after the probe has passed, the intermetallic layer has emerged by interdiffusion.