Development of a Cu-Sn based brazing system with a low brazing and a high remelting temperature

19th Chemnitz Seminar on Materials Engineering – 19. Werkstofftechnisches Kolloquium

Schmieding, M.^1 ; Holländer, U.^1 ; Möhwald, K.^1

Institut für Werktoffkunde, Leibniz Universität Hannover, An der Universität 2, Garbsen

30823, Germany^1

关键词: Brazing temperature;    Diffusion profiles;    Hot working steels;    Joining process;    Line scan;    Processing time;    Pure Cu;    Sn contents;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/181/1/012005/pdf
DOI  :  10.1088/1757-899X/181/1/012005

来源: IOP

【 摘 要 】

Objective of the project presented is the development of a joining process for hot working steel components at low brazing temperatures leading to a bond with a much higher remelting temperature. This basically is achieved by the use of a Cu-Sn melt spinning foil combined with a pure Cu foil. During brazing, the Sn content of the foil is decreased by diffusion of Sn into the additional Cu resulting in a homogenious joint with a increased remelting temperature of the filler metal. Within this project specimens were brazed and diffusion annealed in a vacuum furnace at 850 °C varying the processing times (0 - 10 h). The samples prepared were studied metallographically and diffusion profiles of Sn were recorded using EDX line scans. The results are discussed in view of further investigations and envisaged applications.