Magnetic thin film deposition with pulsed magnetron sputtering: deposition rate and film thickness distribution

8th National Scientific Conference Advances in Electrotechnology (Postepy w Elektrotechnologii)

无线电电子学

Ozimek, M.^1,2 ; Wilczyski, W.^3 ; Szubzda, B.^1

Electrotechnical Institute Division of Electrotechnology and Materials Science, Wroclaw, Poland^1

International Laboratory of High Magnetic Fields and Low Temperatures, Wroclaw, Poland^2

Electrotechnical Institute, Warsaw, Poland^3

关键词: Film thickness distribution;    Magnetron sputtering process;    Pulsed magnetron sputtering;    Radial distance;    Target-substrate distance;    Technological parameters;    Thickness uniformity;    Thin-film depositions;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/113/1/012009/pdf
DOI  :  10.1088/1757-899X/113/1/012009

来源: IOP

【 摘 要 】

The goal of conducted study was an experimental determining the relations between technological parameters of magnetron sputtering process on deposition rate (R) and thickness uniformity of magnetic thin films. Planar Ni79Fei6Mo5target with a diameter of 100 mm was sputtered in argon (Ar) atmosphere. Deposition rate was measured in a function of gas pressure, target power and target-substrate distance. The highest value of R≈280 nmmin-1. The obtained results in deposition rate of magnetic film were compared to deposition rate of cooper (Cu), aluminum (Al), titanium (Ti) and titanium oxide (TiOx) and the deposition rate of Ni-Fe alloy were higher that Al and Ti. The film thickness distribution was measured for radial distance from the target centre ranging up to 60 mm and target-substrate distance ranging form 70 to 115 mm. Among others it was stated that for the larger value of target-substrate distance the larger uniform of film thickness are obtained.