Characterization of ultrafine grained Cu-Ni-Si alloys by electron backscatter diffraction

6th International Conference on Nanomaterials by Severe Plastic Deformation

材料科学;化学

Altenberger, I.^1 ; Kuhn, H.A.^1 ; Gholami, M.^2 ; Mhaede, M.^2 ; Wagner, L.^2

Wieland Werke AG, Central Laboratory, Ulm, Germany^1

Institute of Materials Science and Engineering, Clausthal University of Technology, Clausthal-Zellerfeld, Germany^2

关键词: Crystallographic information;    Electrical conductivity;    Electron back scatter diffraction;    Electron backscattering diffraction;    Electron channeling contrasts;    Mechanical and physical properties;    Ultra fine grained microstructure;    Ultrafine-grained Cu;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/63/1/012135/pdf
DOI  :  10.1088/1757-899X/63/1/012135

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

A combination of rotary swaging and optimized precipitation hardening was applied to generate ultra fine grained (UFG) microstructures in low alloyed high performance Cu-based alloy CuNi3Si1Mg. As a result, ultrafine grained (UFG) microstructures with nanoscopically small Ni2Si-precipitates exhibiting high strength, ductility and electrical conductivity can be obtained. Grain boundary pinning by nano-precipitates enhances the thermal stability. Electron channeling contrast imaging (ECCI) and especially electron backscattering diffraction (EBSD) are predestined to characterize the evolving microstructures due to excellent resolution and vast crystallographic information. The following study summarizes the microstructure after different processing steps and points out the consequences for the most important mechanical and physical properties such as strength, ductility and conductivity.