Increase of adhesion of conductive films on dielectric substrates by means of electric field

24th International Conference on Vacuum Technique and Technology

Pshchelko, N.S.^1 ; Vodkaylo, E.G.^1 ; Klimenkov, B.D.^1

Department of General and Applied Physics, Saint-Petersburg Mining University, Saint Petersburg

199106, Russia^1

关键词: Adhesive bond;    Conductive layer;    Dielectric substrates;    Electric treatment;    Glass substrates;    Ponderomotive forces;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/872/1/012023/pdf
DOI  :  10.1088/1742-6596/872/1/012023

来源: IOP

【 摘 要 】

Films of aluminium and copper produced by vacuum deposition obtained on the glass substrates were investigated. Improve of the efficiency of adhesion of conductive layers was made by the use of ponderomotive forces of an electric field (electroadhesive effects). It is found that thermal and electric treatment of films make possible to increase the strength of the adhesive bond of the film with the dielectric substrate.