Application of the model of the printed circuit board with regard to the topology of external conductive layers for calculation of the thermal conditions of the printed circuit board

International Conference on Information Technologies in Business and Industry 2016

计算机科学;经济学;工业技术

Rybakov, I.M.^1 ; Goryachev, N.V.^1 ; Kochegarov, I.I.^1 ; Grishko, A.K.^1 ; Brostilov, S.A.^1 ; Yurkov, N.K.^1

Penza State University, 40, Krasnaya st., Penza

440026, Russia^1

关键词: Conductive layer;    Radioelectronic means;    Thermal condition;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/803/1/012130/pdf
DOI  :  10.1088/1742-6596/803/1/012130

来源: IOP

【 摘 要 】

The paper proves the necessity of taking into account external conductive layers of the printed circuit board with the thermal physical designing radio-electronic means. For example, a single printed circuit board shows the level of influence of the external conductive layer on the thermal conditions of the printed circuit board. It proved the influence of Joule heat in the thermal conditions of a single conductor. Developed geometrical and thermal printed circuit board models take into account the topological layer and can improve the accuracy of determining the thermal conditions of the printed circuit board.