Liquid phase diffusion bonding of A1070 by using metal formate coated Zn sheet

6th International Conference on Fracture Fatigue and Wear

Ozawa, K.^1 ; Koyama, S.^2 ; Shohji, I.^2

Graduate School of Science and Technology, Gunma University, Tenjin-cho, Kiryu, Gunma

376-8515, Japan^1

Faculty of Science and Technology, Gunma University, Tenjin-cho, Kiryu, Gunma

376-8515, Japan^2

关键词: Bonding aluminiums;    Bonding temperatures;    Conducting materials;    Fractured surfaces;    Interfacial microstructure;    Liquid phase diffusion;    Positional accuracy;    Ultimate tensile strength;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/843/1/012005/pdf
DOI  :  10.1088/1742-6596/843/1/012005

来源: IOP

【 摘 要 】

Aluminium alloy have high strength and easily recycle due to its low melting point. Therefore, aluminium is widely used in the manufacturing of cars and electronic devices. In recent years, the most common way for bonding aluminium alloy is brazing and friction stir welding. However, brazing requires positional accuracy and results in the formation of voids by the flax residue. Moreover, aluminium is an excellent heat radiating and electricity conducting material; therefore, it is difficult to bond together using other bonding methods. Because of these limitations, liquid phase diffusion bonding is considered to the suitable method for bonding aluminium at low temperature and low bonding pressure. In this study, the effect of metal formate coating processing of zinc surface on the bond strength of the liquid phase diffusion bonded interface of A1070 has been investigated by SEM observation of the interfacial microstructures and fractured surfaces after tensile test. Liquid phase diffusion bonding was carried out under a nitrogen gas atmosphere at a bonding temperature of 673 K and 713 K and a bonding load of 6 MPa (bonding time: 15 min). As a result of the metal formate coating processing, a joint having the ultimate tensile strength of the base aluminium was provided. It is hypothesized that this is because metallic zinc is generated as a result of thermal decomposition of formate in the bonded interface at lower bonding temperatures.