Modelling of process formation of the nanocomposite TiN-Cu layers received by vacuum-arc evaporation of Ti and magnetron sputtering of Cu

5th International Congress on Energy Fluxes and Radiation Effects 2016

Tsyrenov, D.B.-D.^1 ; Semenov, A.P.^1 ; Smirnyagina, N.N.^1

Institute of Physical Materials Science SB RAS, Sakhyanovoy 6, Ulan-Ude

670047, Russia^1

关键词: Calculation formula;    Cathode substrates;    Condensation flow;    Deposition process;    Fused silica substrates;    Modelling of process;    Perpendicular-plane;    Vacuum arc evaporation;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/830/1/012091/pdf
DOI  :  10.1088/1742-6596/830/1/012091

来源: IOP

【 摘 要 】

Modeling a TiN-Cu layers deposition process on a fused silica substrate under given conditions is carried out in this work. Calculation formulas which allow to determine the films thickness and their uniformity, with a substrate holder being located at an angle of 45 degrees to the normals of mutually perpendicular planes of the evaporated titanium cathode and the magnetron sputtering copper cathode, are given. The results of this work will be used to analyze the distribution velocity of the substance condensation flow and the character of the formed composite layers depending on the geometry of the cathode-substrate system.