A review of the technology and process on integrated circuits failure analysis applied in communications products

8th International Conference on Advanced Infocomm Technology

Ming, Zhimao^1 ; Ling, Xiaodong^1 ; Bai, Xiaoshu^1 ; Zong, Bo^1

China Satellite Maritime Tracking and Control Department, Jiangsu

214431, China^1

关键词: Acoustic microscopy;    Communication products;    Electrical measurement;    Failure mechanism;    Hot spot detection;    Improvement measure;    Integrated circuit failures;    Microscopic analysis;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/679/1/012040/pdf
DOI  :  10.1088/1742-6596/679/1/012040

来源: IOP

【 摘 要 】

The failure analysis of integrated circuits plays a very important role in the improvement of the reliability in communications products. This paper intends to mainly introduce the failure analysis technology and process of integrated circuits applied in the communication products. There are many technologies for failure analysis, include optical microscopic analysis, infrared microscopic analysis, acoustic microscopy analysis, liquid crystal hot spot detection technology, optical microscopic analysis technology, micro analysis technology, electrical measurement, microprobe technology, chemical etching technology and ion etching technology. The integrated circuit failure analysis depends on the accurate confirmation and analysis of chip failure mode, the search of the root failure cause, the summary of failure mechanism and the implement of the improvement measures. Through the failure analysis, the reliability of integrated circuit and rate of good products can improve.