Thermal management of power sources for mobile electronic devices based on micro-SOFC

14th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications

物理学;能源学

Murayama, S.^1 ; Iguchi, F.^1 ; Shimizu, M.^1 ; Yugami, H.^1

Graduate School of Engineering, Tohoku University, Japan^1

关键词: Heat-conduction analysis;    High energy efficiency;    High operating temperature;    High-efficiency;    Mobile electronics;    Proof of concept;    Thermal recovery;    Thermochemical calculations;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/557/1/012050/pdf
DOI  :  10.1088/1742-6596/557/1/012050

来源: IOP

【 摘 要 】

Small power sources based on micro-SOFC for mobile electronic devices required two conditions, i,e, thermally compatibility and thermally self-sustain, because of high operating temperature over 300oC. Moreover, high energy efficiency was also required. It meant that this system should be designed considering thermal management. In this study, we developed micro-SOFC packages which have three functions, thermal insulation, thermal recovery, and self-heating. Heat conduction analysis based on finite element method, and thermochemical calculation revealed that vacuum thermal insulation was effective for size reduction and gas-liquid heat exchanger could reduce the temperature of outer surface. We fabricated the package with three functions for proof of concept and evaluated. As a result, it was suggested that developed package could satisfy both two requirements with high efficiency.