Application of Laser Ultrasound to Noncontact Temperature Profiling of a Heated Hollow Cylinder

3rd International Symposium on Laser Ultrasonics and Advanced Sensing

Kosugi, A.^1 ; Ono, Y.^1 ; Matsuya, I.^2 ; Ihara, I.^2

Graduate School of Nagaoka University of Technology, Niigata 940-2188 Nagaoka, Japan^1

Department of Mechanical Engineering, Nagaoka University of Technology, Niigata 940-2188 Nagaoka, Japan^2

关键词: Application of laser;    Constant heat flux;    Heat-conduction analysis;    Laser ultrasonic measurements;    Laser ultrasonic systems;    Surface acoustic wave (SAW);    Temperature profiling;    Thick-walled hollow cylinder;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/520/1/012015/pdf
DOI  :  10.1088/1742-6596/520/1/012015

来源: IOP

【 摘 要 】

A new ultrasonic method to monitor the temperature distributions of a thick-walled hollow cylinder whose inner surface is heated is presented. This method basically consists of laser ultrasonic measurements and a heat conduction analysis of the heated hollow cylinder. Both longitudinal wave (LW) and surface acoustic wave (SAW) are used for estimating the temperature distribution of the cylinder. To demonstrate the validity of the proposed method, a numerical simulation and an experiment are carried out. In the numerical simulation, a steel hollow cylinder (the inner and outer diameters are 20 mm and 100 mm, respectively) is uniformly heated by a constant heat flux at the inner surface. It has been verified in the simulation that temperature distributions estimated by the proposed method completely agreed with the theoretical results. In the experiment, an aluminum hollow cylinder (the inner and outer diameters are 20 mm and 50 mm, respectively) is heated by pouring molten metal at 300 °C into the hollow cavity of the cylinder. A laser ultrasonic system is used for measuring both LW and SAW of the heated cylinder. It has also been demonstrated that the proposed method can measure the change in the temperature distribution during heating.