Thermal characterization of micro thermoelectric coolers: an analytical study

32nd UIT (Italian Union of Thermo–fluid-dynamics) Heat Transfer Conference

物理学;力学

De Aloysio, G.^1 ; De Monte, F.^2

Department of Information Engineering, Computer Science and Mathematics, University of l'Aquila, Via Vetoio, L'AQUILA

67100, Italy^1

Department of Industrial and Information Engineering and Economics, University of l'Aquila, Via Gronchi 18, L'AQUILA

67100, Italy^2

关键词: Analytical studies;    Coefficient of Performance;    Heat diffusion equations;    Micro thermoelectric coolers;    Numerical inversion;    Separation of variables;    Thermal behaviours;    Thermal characterization;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/547/1/012007/pdf
DOI  :  10.1088/1742-6596/547/1/012007

学科分类：力学，机械学

来源: IOP

【 摘 要 】

Aim of this paper is to provide a complete characterization of the transient thermal behaviour of thermoelectric (TE) micro-coolers by solving the parabolic heat diffusion equation, through two different analytical methods, the Laplace Transform (LT) and the Separation of Variables (SOV). The results of the performed analysis show that a numerical inversion of the Laplace Transform is necessary, because the analytical-based Riemann-sum approximation does not yield temperature values at very early times. Once the temperature distribution is known in both the semiconductors of the p-n junction, the heat fluxes and the coefficient of performance (COP) of the cooler may be obtained. Then, by applying the proposed procedure to an existing micro-TE cooler, it is observed that the cooling load and the COP reach their maximum values, 2.9 W and 2, respectively, at different times, 3.4 ms vs. 1.7 ms. When a steady-state is reached, the micro-system is characterized by a cooling load of about 1.9 W with an efficiency of nearly 0.5, both in agreement with experimental and numerical data.