Benchmarking of a novel contactless characterisation method for micro thermoelectric modules (μTEMs)

Eurotherm Seminar 102: Thermal Management of Electronic Systems

物理学;无线电电子学

Hickey, S.^1 ; Punch, J.^1 ; Jeffers, N.^2

CTVR, Stokes Institute, University of Limerick, Limerick, Ireland^1

Thermal Management Research Group, Bell Labs, Alcatel-Lucent Ireland, Blanchardstown, I-Dublin-15, Ireland^2

关键词: Component density;    Control methods;    Energy efficient;    Mechanical stress;    Operating condition;    Performance data;    Photonics Integrated Circuits;    Thermo-electric modules;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/525/1/012021/pdf
DOI  :  10.1088/1742-6596/525/1/012021

来源: IOP

【 摘 要 】

Significant challenges exist in the thermal control of Photonics Integrated Circuits (PICs) for use in optical communications. Increasing component density coupled with greater functionality is leading to higher device-level heat fluxes, stretching the capabilities of conventional cooling methods using thermoelectric modules (TEMs). A tailored thermal control solution incorporating micro thermoelectric modules (μTEMs) to individually address hotspots within PICs could provide an energy efficient alternative to existing control methods. Performance characterisation is required to establish the suitability of commercially-available μTEMs for the operating conditions in current and next generation PICs. The objective of this paper is to outline a novel method for the characterisation of thermoelectric modules (TEMs), which utilises infra-red (IR) heat transfer and temperature measurement to obviate the need for mechanical stress on the upper surface of low compression tolerance (∼0.5N) μTEMs. The method is benchmarked using a commercially-available macro scale TEM, comparing experimental data to the manufacturer's performance data sheet.