Influence of shock loading kinetics on the spall response of copper

18th APS-SCCM; 24th AIRAPT

Escobedo, J.P.^1 ; Cerreta, E.K.^2 ; Dennis-Koller, D.^2 ; Patterson, B.M.^2 ; Bronkhorst, C.A.^2

UNSW Canberra at ADFA, Canberra

ACT

2600, Australia^1

Los Alamos National Laboratory, Los Alamos

NM

87545, United States^2

关键词: Electron back scatter diffraction;    Grain misorientation;    High purity copper;    Plastic dissipation;    Plate impact;    Shock loadings;    Time-dependent behaviour;    Void growth;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/500/11/112023/pdf
DOI  :  10.1088/1742-6596/500/11/112023

来源: IOP

【 摘 要 】

A suite of plate-impact experiments was designed and conducted to examine the influence of loading kinetics on the spall response of high purity copper samples. The peak compressive stresses (1.5 GPa) and the density of grain boundaries dynamically loaded were held constant for all experiments. The kinetics of the tensile pulses were designed using a hydrodynamic, shock-wave propagation code and experimentally achieved by controlling the geometry of copper impactors and targets. Examination of damage fields shows that the total fraction of damage (voids) increases as the tensile rates decrease. In addition, an accompanying larger plastic dissipation, in the form of grain misorientation measured by means of electron backscatter diffraction, is present in the samples deformed at lower tensile rates. These results suggest a time dependent behaviour of the processes the plastic processes for void growth.