Electromagnetic Thermal Coupling Simulation Analysis of Silicon Carbide Shock Absorber

3rd International Conference on Aeronautical Materials and Aerospace Engineering

航空航天工程

Xiaofang, Yin^1 ; Xiaoning, Liu^1 ; Jiayong, Qin^1 ; Chunlin, Du^1

Beijing Institute of Spacecraft Environment Engineering, Beijing

100094, China^1

关键词: Absorbing properties;    Electrical conductivity;    Electromagnetic-thermal coupling;    Finite element method models;    Low temperature environment;    Multiphysics simulations;    Practical engineering applications;    Simulation calculation modeling;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/608/1/012009/pdf
DOI  :  10.1088/1757-899X/608/1/012009

学科分类：航空航天科学

来源: IOP

【 摘 要 】

This paper introduces a set of absorbing equipment used in 3.2GHz band vacuum high and low temperature environment. Through the finite element method modeling, COMSOL Multiphysics multi-physics simulation software analyzes the electromagnetic thermal coupling capability. The simulation results show that the absorbing properties of the silicon carbide pyramidal absorbing material are good. If the loss caused by the electrical conductivity of silicon carbide is considered, the absorbing performance of the silicon carbide pyramid will be greatly improved to-40dB. The simulation calculation model combines the electromagnetic field with the thermal, and gives the temperature curve and the isothermal contour dynamic diagram of the pyramid. It provides theoretical guidance for practical engineering applications.