Finite Element Analysis of Circular Silicon Diaphragm

International Conference on Startup Ventures: Technology Developments and Future Strategies

社会科学（总论）

Samridhi^1 ; Kumar, Manish^2 ; Singh, Kulwant^3 ; Alvi, P.A.^1

Department of Physics, Banasthali Vidyapith, Banasthali, Rajasthan

304022, India^1

School of Engineering, Indian Institute of Technology, Mandi, Himachal Pradesh

175005, India^2

Department of Electronics and Communication Engineering, Manipal University Jaipur, Jaipur, Rajasthan

303007, India^3

关键词: Different pressures;    Displacement;    Frequency;    Meshing;    Micro electro mechanical system;    Performance and reliabilities;    Silicon diaphragm;    Weather monitoring;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/594/1/012045/pdf
DOI  :  10.1088/1757-899X/594/1/012045

学科分类：社会科学、人文和艺术（综合）

来源: IOP

【 摘 要 】

Miniaturization of sensing devices not only reduces the size, but also enhances the performance and reliability in sector of automation, space, weather monitoring and forecasting. It has become important for scientist and researchers working in the field of micro-electro-mechanical system area to simulate the structure before actual fabrication. This paper reports about the performance of proper meshing required to lead the exact results of simulated circular silicon diaphragm with the help of finite element method. In this paper, we have shown that the proper meshing of the circular silicon diaphragm has shifted the vibrating frequency of the diaphragm under different pressures applied.