Study on Electrochemical and electrical discharge compound Micro-machining for Silicon

2019 International Conference on Advanced Electronic Materials, Computers and Materials Engineering

无线电电子学;计算机科学;材料科学

Chen, Hui^1 ; Shi, Lei^2

College of Mechanical and Electrical Engineering, Central South University of Forestry and Technology, Changsha

410004, China^1

Information Center, Central South University of Forestry and Technology, Changsha

410004, China^2

关键词: Electrical discharge machining;    Electrochemical machining;    Hydrochloric acid solution;    Micro electro mechanical system;    Micro three-dimensional structure;    Micro-fabrication technology;    Microfabrication methods;    Non-conductive materials;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/563/2/022018/pdf
DOI  :  10.1088/1757-899X/563/2/022018

来源: IOP

【 摘 要 】

Silicon material is a widely used substrate in micro-electromechanical systems, and its micro-fabrication technology has always been a research hotspot. The main microfabrication methods of silicon material are chemical etching, electrochemical machining (ECM) and electrical discharge machining (EDM). The electrochemical and electrical discharge compound machining technology is a kind of machining method for non-conductive materials. In this paper, the compound machining technology was studied and applied to the microfabrication of silicon material. The machining principle of silicon material in hydrochloric acid solution was studied, and the influence of silicon material type and voltage on the machining was analyzed. It is found that n-type silicon can be machined, while p-type silicon can hardly be machined. With this technology, micro three-dimensional structures can be fabricated on silicon material.