The effect of CNT and Cu on interfacial intermetallic growth of Sn-Ag-Cu solder

1st International Postgraduate Conference on Mechanical Engineering

工业技术（总论）;机械制造

Nur Liyana, M.H.^1 ; Azmah Hanim, M.A.^1 ; Sulaiman, Shamsuddin^1 ; Saliza Azlina, O.^2

Department of Mechanical and Manufacturing Engineering, Universiti Putra Malaysia, UPM Serdang Selangor

43400, Malaysia^1

Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, Batu Pahat

86400, Malaysia^2

关键词: Effect of coppers;    IMC thickness;    Interfacial growth;    Interfacial intermetallics;    Intermetallic compound thickness;    SnAgCu solder;    Solder joints;    Weight percentages;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/469/1/012007/pdf
DOI  :  10.1088/1757-899X/469/1/012007

学科分类：工业工程学

来源: IOP

【 摘 要 】

In this study, the effect of copper and carbon nanotubes (CNT) composition on interfacial growth of various Sn-Ag-Cu (SAC) solder joints were investigated. SAC is proven to have good reliability and mechanical properties but lacking in terms of melting point and wettability. Thus, Sn-4.0 wt%Ag-0.3wt%Cu (SAC403) and Sn-4.0 wt%Ag-0.7 wt%Cu (SAC407) were reinforced with CNT with various weight percentages of 0 to 0.1wt%. The wetting angle and intermetallic compound (IMC) thickness is measured using optical microscope (Olympus BX5/M) and Olympus Stream Essentials software. The high Cu content alloys formed a long Cu6Sn5 whisker which act as an obstacle to crack propagation. CNT improves wettability and IMC layer growth for both SAC403 and SAC407 by lowering the wetting angle and IMC thickness compared to the plain solder.