Investigation on the Interfacial IMCs Layer of Sn-58Bi/Cu Solder Joints

2nd International Symposium on Resource Exploration and Environmental Science

生态环境科学

Qu, Min^1 ; Cao, Tianze^1 ; Cui, Yan^1 ; Liu, Fengbin^1 ; Jiao, Zhiwei^1

School of Mechanical and Materials Engineering, North China University of Technology, Beijing

100144, China^1

关键词: Aging time;    Cu atoms;    Cu leads;    Cu substrate;    Interfacial intermetallics;    Kinetic equations;    Solder joints;   

Others  :  https://iopscience.iop.org/article/10.1088/1755-1315/170/4/042066/pdf
DOI  :  10.1088/1755-1315/170/4/042066

学科分类：环境科学（综合）

来源: IOP

【 摘 要 】

The interfacial intermetallic compounds (IMCs) layer of Sn-58Bi lead-free solder reacting with Cu substrate were explored at aging stage after soldering for 1day, 3days, 6days, 8days and 10days, respectively. Results show that Bi doesn't react with Cu atoms or Sn atoms. The IMCs layer is composed of Cu6Sn5 phase and Cu3Sn phase. The IMCs layer evolves from scalloped shape to layer shape with addition of aging time, meanwhile, Bi phase in matrix grows bigger. The growth kinetic equation of IMCs layer is obtained and described as X=1.06+0.69t 1/2, where 0.69μm/d1/2 is the growth coefficient. Compared with Sn-3Ag-0.5Cu lead-free solder, the growth coefficient of Sn-58Bi solder is much smaller. Accordingly, the growth of IMCs layer of Sn-58Bi solder is more slowly than that of Sn-3Ag-0.5 Cu solder.