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1 Thermal performance enhancement of packaging substrates with integrated vapor chamber [学位论文]

作者:Cho, Sangbeom, Joshi, Yogendra Tummala, Rao Mechanical Engineering Sitaraman, Suresh Graham, Samuel Sundaram, Venkatesh, Joshi, Yogendra   

论文开放时间:2018

关键词:Glass interposer;TPV;...

培养单位:University:Georgia Institute of Technology

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