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1 Experimental and Numerical Thermal Analysis for Advanced Flip Chip Thermo-Compression Bonding via CMOS Microsensor Arrays and Finite Element Modelling [学位论文]

作者:Athia, Depayneadvisor:Mayer, Michael, affiliation1:Faculty of Engineering, Mayer, Michael   

论文开放时间:2017

关键词:CMOS;Gold bumps;...

培养单位:University of Waterloo

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2 Absorbing Boundary Conditions and Numerical Methods for the Linearized Water Wave Equation in 1 and 2 Dimensions. [学位论文]

作者:Prigge, David K.Roe, Philip L   

论文开放时间:2016

关键词:mathematics;numerical analysis;...

培养单位:University of Michigan

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3 Curvelets, Wave Atoms, and Wave Equations [学位论文]

作者:Demanet, Laurent, Candes, Emmanuel J.   

论文开放时间:2006

关键词:harmonic analysis;microlocal analysis;...

培养单位:University:California Institute of Technology

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