1 An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates. [科技报告]
作者:Uribe, Fernando R.;Kilgo, Alice C.;Grazier, John Mark;等
发布日期:2008
关键词:SILICON;CERAMICS;...
发布机构:
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