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  • × 5th Annual International Workshop on Materials Science and Engineerin
  • × Hardness and elastic modulus
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1 The Evolution of Microstructures and Mechanical Properties of SnAgCu/Cu Weld Interface during Isothermal Aging [会议论文]

作者:Chen, Haiyan^1, Huang, Liyang^1, Guo, Li^2

关键词:Cumulative effects;Diffusion mechanisms;...

会议举办机构:School of Materials and Energy, Guangdong University of Technology, Guangzhou

会议时间:2019

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