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1 Effects of copper content in Sn-based solder on the intermetallic phase formation and growth during soldering [会议论文]

作者:Mookam, N.^1, Tunthawiroon, P.^1, Kanlayasiri, K.^1

关键词:Copper content;Cu content;...

会议举办机构:Department of Industrial Engineering, Faculty of Engineering, King Mongkut's Institute of Technology, Ladkrabang, Bangkok

会议时间:2018

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