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× Stress singularities
作者:Gao, Song^1, Qiu, Chuxia^2, Li, Kun^1
关键词:Notch stress intensity factors;Singularity strength;...
会议举办机构:China Waterborne Transport Research Institute, Beijing
会议时间:
2 Strength evaluation of butt joint by stress intensity factor of small edge crack near interface edge [会议论文]
作者:Sato, T.^1, Oda, K.^2, Tsutsumi, N.^2
关键词:Adhesive strength;Bonded dissimilar materials;...
会议举办机构:Graduate School of Engineering, Oita University, 700 Dannoharu, Oita
会议时间:2018
作者:Lederer, M.^1, Khatibi, G.^1
关键词:Atomic bonds;Bending moduli;...
会议举办机构:Institute of Chemical Technologies and Analytics, Vienna University of Technology, Christian Doppler Laboratory for Lifetime and Reliability of Interfaces, Complex Multi-Material Electronics, Wien, Austria^1
会议时间:2017
作者:Borzenko, E.I.^1, Ryltseva, K.E.^1, Shrager, G.R.^1
关键词:Axisymmetric channels;Finite difference approach;...
会议举办机构:National Research Tomsk State University, 36 Lenin Avenue, Tomsk
会议时间:2019
作者:Negru, R.^1, Marsavina, L.^1, Hluscu, M.^1
关键词:Adhesive layers;Adhesively bonded joints;...
会议举办机构:Politehnica University Timisoara, Timisoara, Romania^1
会议时间:2016