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× Singular stress field
作者:Oda, Kazuhiro^1, Kawakita, Masato^2, Noriko, Tsutsumi^1
关键词:Adhesive thickness;Bonded dissimilar materials;...
会议举办机构:Department of Mechanical and Energy Systems Engineering, Oita University, 700 Dunnoharu, Oita, Japan^1
会议时间:2017
2 Evaluation of debonding strength of single lap joint by the intensity of singular stress field [会议论文]
作者:Miyazaki, Tatsujiro^1, Noda, Nao-Aki^2
关键词:Adherend thickness;Adhesive thickness;...
会议举办机构:University of the Ryukyus, 1 Senbaru, Nishihara-cho, Nakagami-gun, Okinawa
会议时间:2017
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作者:Noda, N.-A.^1;Tsuboi, K.^1;Takaki, R.^1;等
关键词:Adhesive thickness;Critical intensity;...
会议举办机构:Department of Mechanical Engineering, Kyushu Institute of Technology, Sensui-Cho 1-1, Tobata-Ku, Kitakyushu-Shi, Fukuoka, Japan^1
会议时间:2018
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作者:Chen, D.^1;Zhang, G.W.^1;Takaki, R.^1;等
关键词:Analysis method;Body force method;...
会议举办机构:Department of Mechanical and Control Engineering, Kyushu Institute of Technology, Sensui-Cho 1-1, Tobata-Ku, Kitakyushu-Shi, Fukuoka, Japan^1
会议时间:2018
作者:Ping, X.C.^1,2, Wang, C.G.^1, Cheng, L.P.^1
关键词:Analytical method;Calculation accuracy;...
会议举办机构:School of Mechanical Engineering, Tianjin University of Science and Technology, China^1
会议时间:2018
6 Strength evaluation of butt joint by stress intensity factor of small edge crack near interface edge [会议论文]
作者:Sato, T.^1, Oda, K.^2, Tsutsumi, N.^2
关键词:Adhesive strength;Bonded dissimilar materials;...
会议举办机构:Graduate School of Engineering, Oita University, 700 Dannoharu, Oita
会议时间:2018
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