• 已选条件：
  • × Collaborative Innovation Center of Non-ferrous Metals, Luoyang, China^3
  • × Ultrasonic vibration
 全选  【符合条件的数据共：2条】

1 Spreading and Wetting Behaviors of Sn2.5Ag0.7Cu0.1RE0.05Ni Solder on the Surface of Cu Substrate under Ultrasonic Vibration [会议论文]

作者:Yin, Chenxiang^1;Zhang, Keke^1^2^3;Li, Shijie^1;等

关键词:Base metals;Cu substrate;...

会议举办机构:School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, China^1

会议时间:2019

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2 Influence of Ultrasonic Vibration Power on the Wettability and Interfacial Microstructure of Sn2.5Ag0.7Cu0.1RE0.05Ni Solder Alloy on Cu Substrate [会议论文]

作者:Zhao, Di^1;Zhang, Keke^1,2,3;Cui, Jianguo^1;等

关键词:Cu substrate;Grain size;...

会议举办机构:School of Materials Science and Engineering, Henan University of Science and Technology, Louyang, China^1

会议时间:2018

预览  |  原文链接  |  全文  [ 浏览：11 下载：1  ]