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  • × International Conference on Recent Advancements and Effectual Researches in Engineering Science and Technolog
  • × Inverse analysis
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1 Estimation of in-plane thermal conductivity of copper clad board by inverse analysis using artificial neural networks [会议论文]

作者:Niju Mohammed, K.^1, Chanda, Samarjeet^2

关键词:Back propagation artificial neural network (BPANN);Electronic application;...

会议举办机构:Indian Institute of Technology Madras, Chennai

会议时间:2018

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