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× Cooling conditions
1 Numerical model of applying PCM boards for energy saving in lightweight buildings in Shanghai [会议论文]
作者:Wang, Huakeer^1, Lu, Wei^1, Wu, Zhigen^2
关键词:Air-conditioning energy savings;Building industry;...
会议举办机构:University of Shanghai for Science and Technology, 516 Jungong Road, Shanghai
会议时间:2019
作者:Yu, Wenhong^1, Tong, Sichen^1, Zheng, Chao^2
关键词:Air distribution;Bad quality;...
会议举办机构:North China University of Technology, Beijing
会议时间:2018
作者:Bleile, A.^1;Fischer, E.^1;Khodzhibagiyan, H.^2;等
关键词:Cooling channels;Cooling conditions;...
会议举办机构:GSI, Germany^1
会议时间:2014
作者:Aydodu, Y.^1;Kök, M.^2;Dadelen, F.^2;等
关键词:Co alloys;Cooling conditions;...
会议举办机构:Gazi University, Faculty of Science, Department of Physics, Superconductivity and Thermal Analysis Laboratory, Ankara, Turkey^1
会议时间:2016
作者:Kik, T.^1, Moravec, J.^2, Novakova, I.^2
关键词:Comparison standard;Computational model;...
会议举办机构:Silesian University of Technology, Konarskiego 18a Street, Gliwice
会议时间:2017
6 Influence of Cooling Condition on the Performance of Grinding Hardened Layer in Grind-hardening [会议论文]
作者:Wang, G.C.^1,2;Chen, J.^1;Xu, G.Y.^1;等
关键词:Cooling conditions;Grind hardening;...
会议举办机构:School of Mechanical Engineering, Jiangsu University, Zhenjiang, Jiangsu
会议时间:2018