Design and demonstration of ultra-miniaturized glass-based 3d IPD diplexers and 3d IPAC RF front-end modules for LTE applications

RF;LTE;Diplexer;Module;Glass;Substrate;Assembly;3D;High-Q;Front-end

Wu, Zihan ; Tummala, Rao R. Electrical and Computer Engineering Peterson, Andrew F. Tentzeris, Manos M. Pulugurtha, Markondeya Raj Hesketh, Peter J. ; Tummala, Rao R.

University:Georgia Institute of Technology

Department:Electrical and Computer Engineering

关键词: RF;    LTE;    Diplexer;    Module;    Glass;    Substrate;    Assembly;    3D;    High-Q;    Front-end;   

Others  :  https://smartech.gatech.edu/bitstream/1853/60702/1/WU-DISSERTATION-2017.pdf

美国|英语

来源: SMARTech Repository

【 摘 要 】

The objective of this dissertation is to design and demonstrate three-dimensional integrated passive device (3D IPD) diplexers and three-dimensional integrated passive and active component (3D IPAC) packages with ultra-miniaturized glass substrates for radio frequency (RF) fourth generation long-term evolution (4G LTE) front-end modules (FEMs). First, miniaturized low-loss high-rejection diplexers were designed and demonstrated on thin glass substrates as double-side embedded thinfilm passives, interconnected with through glass vias. Excellent manufacturing precision was achieved through comprehensive design sensitivity analysis and substrate process optimization. Second, 3D LTE modules were demonstrated on ultra-thin glass substrates with double-side integration of discrete components and substrate-embedded impedance matching networks. Design and process innovations on ultra-thin (50 -100 μm) glass substrates enabled high-Q passives embedding, component-level electromagnetic interference (EMI) shielding and high package reliability. The proposed high-density 3D integration technology of RF passives and modules on advanced glass substrates, further extends the existing wireless communication systems towards high performance, multi-functionality and ultra-miniaturization.