学位论文详细信息
| Study on the curing process of no-flow and wafer level underfill for flip-chip applications | |
| Flip chip technology;Semiconductor wafers Curing;Electronic packaging | |
| Zhang, Zhuqing ; Materials Science and Engineering | |
| University:Georgia Institute of Technology | |
| Department:Materials Science and Engineering | |
| 关键词: Flip chip technology; Semiconductor wafers Curing; Electronic packaging; | |
| Others : https://smartech.gatech.edu/bitstream/1853/5380/1/zhang_zhuqing_200312_phd.pdf | |
| 美国|英语 | |
| 来源: SMARTech Repository | |
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| Files | Size | Format | View |
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| Study on the curing process of no-flow and wafer level underfill for flip-chip applications | 41710KB |  download |
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