Study on the Nanocomposite Underfill for Flip-Chip Application

Colloids;Nanocomposites;Electronic packaging;Polymers

Sun, Yangyang ; Chemistry and Biochemistry

University:Georgia Institute of Technology

Department:Chemistry and Biochemistry

关键词: Colloids;    Nanocomposites;    Electronic packaging;    Polymers;   

Others  :  https://smartech.gatech.edu/bitstream/1853/13975/1/sun_yangyang_200612_phd.pdf

美国|英语

来源: SMARTech Repository

【 摘 要 】

Underfill material is a special colloidal dispersion system with silicon dioxide particles in the organic liquid. It is used to improve the reliability of integrated circuits (IC) packaging in the microelectronics. In order to successfully synthesize the nanocomposite underfill meeting the requirements of the chip package, it is necessary to have a fundamental understanding about the particle stability in the non-aqueous liquid and the relationship between materials properties and interphase structure in the composite. The results of this thesis contribute to the knowledge of colloidal dispersion of nanoparticles in organic liquid by systematically investigating the effects of particle size, particle surface chemistry and surface tension, and liquid medium polarity upon the rheological and thermal mechanical properties of underfill materials. The relaxation and dielectric properties studies indicate that the polymer molecular chain motion and polarization in the interphase region can strongly influence the material properties of nanocomposite, and so a good interaction between particle and polymer matrix is key. With this study, a potential nanocomposite underfill can be synthesized with low viscosity, low thermal expansion, and high glass transition temperature. The excellent transmittance of nanoparticles leads to further investigation of their ability as reinforcing filler in the photo-curable polymer.