Prospects for Mirror-Enabled Polymer Pillar I/O Optical Interconnects for Gigascale Integration

Mirrors;Polymer pillars;Finite-difference time-domain;FDTD;Optical interconnects;Gigascale integration;Silicon

Ogunsola, Oluwafemi Olusegun ; Engineering Electrical Engineering

University:Georgia Institute of Technology

Department:Engineering

关键词: Mirrors;    Polymer pillars;    Finite-difference time-domain;    FDTD;    Optical interconnects;    Gigascale integration;    Silicon;   

Others  :  https://smartech.gatech.edu/bitstream/1853/14067/1/ogunsola_oluwafemi_o_200612_phd.pdf

美国|英语

来源: SMARTech Repository

【 摘 要 】

Digital systems have derived performance benefits due to the scaling down of CMOS microprocessor feature sizes towards packing billions of transistors on a chip, or gigascale integration (GSI).This has placed immense bandwidth demands on chip-to-chip and chip-to-board interconnects.The present-day electrical interconnect may limit bandwidth as transmission rates grow.As such, optical interconnects have been proposed as a potential solution.A critical requirement for enabling chip-to-chip and chip-to-board optical interconnection is out-of-plane coupling for directing light between a chip and the board.Any solution for this problem must be compatible with conventional packaging and assembly requirements.This research addresses the prospects for integrating waveguides with mirrors and polymer pillar optical I/O interconnects to provide such a compatible, out-of-plane, chip-to-board packaging solution through the design, analysis, fabrication, and testing of its constituent parts and their ultimate integration.