Application of the latency insertion method (LIM) to the analysis of large circuit interconnect networks

circuit simulation;latency insertion;power integrity;power distribution network analysis;electrothermal analysis;IR drop;Latency insertion method (LIM)

Klokotov, Dmitri

关键词: circuit simulation;    latency insertion;    power integrity;    power distribution network analysis;    electrothermal analysis;    IR drop;    Latency insertion method (LIM);   

Others  :  https://www.ideals.illinois.edu/bitstream/handle/2142/29639/Klokotov_Dmitri.pdf?sequence=1&isAllowed=y

美国|英语

来源: The Illinois Digital Environment for Access to Learning and Scholarship

【 摘 要 】

The focus of this research is to explore the applications of the finite difference formulation based on the latency insertion method (LIM) to the analysis of circuit interconnects. Special attention is devoted to addressing the issues that arise in very large networks such as on-chip signal and power distribution networks. We demonstrate that the LIM has the power and flexibility to handle various types of analysis required at different stages of circuit design. The LIM is particularly suitable for simulations of very large scale linear networks and can significantly outperform conventional circuit solvers (such as SPICE).