Aluminum oxide is one of the most important ceramic oxides and has a wide range of uses, including high-temperature applications and microelectronics. Recently, the Center for Plasma-Material Interaction (CPMI) has developed innovative coating method of Evaporative Coating at Atmospheric Pressure (ECAP). This new idea is an atmospheric-pressure based process. By using the thermal energy of plasma, solid aluminum are evaporated and then produce a PVD-like alumina coating on a work piece. The aluminum rod is inserted in the center of the microwave torch feeding a melt pool and evaporates into the surrounding plasma plume. It can be deposits as Al2O3 if done in an oxygen environment or as AlN with nitrogen. A gas shield keeps the working gas pure. Following the same concept as the Laser Assisted Plasma Coating at Atmospheric Pressure (LAPCAP), the material captured by the plasma plume is atomic in nature (the evaporated metal atom) and should therefore end up deposited molecule-by-molecule as in a PVD fashion. A much higher thermal energy of the plasma plume will make a superior coating microstructure as compared to a purely evaporated film. On the contrary, aluminum evaporated in an oxygen environment will merely makes alumina dust.
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Deposition of aluminum oxide by evaporative coating at atmospheric pressure (ECAP)