There has been an increase in demand for the wafer-level test techniques that evaluatesthe functionality and performance of the wafer chips before packaging them, since thetrend of integrated circuits are getting more sophisticated and smaller in size. Throughoutthe wafer-level test, the semiconductor manufacturers are able to avoid the unnecessarypacking cost and to provide early feedback on the overall status of the chip fabricationprocess. A probe card is a module of wafer-level tester, and can detect the defects of thechip by evaluating the electric characteristics of the integrated circuits(IC;;s). A probe cardanalyzer is popularly utilized to detect such a potential probe card failure which leads toincrease in the unnecessary manufacture expense in the packing process.In this paper, a new probe card analysis strategy has been proposed. The main idea inconducting probe card analysis is to operate the vision-based inspection on-the-y while thecamera is continuously moving. In doing so, the position measurement from the encoder is rstly synchronized with the image data that is captured by a controlled trigger signal underthe real-time setting. Because capturing images from a moving camera creates blurring inthe image, a simple deblurring technique has been employed to restore the original stillimages from blurred ones. The main ideas are demonstrated using an experimental testbed and a commercial probe card. The experimental test bed has been designed thatcomprises a micro machine vision system and a real-time controller, the con guration ofthe low cost experimental test bed is proposed. Compared to the existing stop-and-goapproach, the proposed technique can substantially enhance the inspection speed withoutadditional cost for major hardware change.
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High-Speed Probe Card Analysis Using Real-time Machine Vision and Image Restoration Technique
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