High Performance Packaging Solutions for Low Cost, Reliable PV Modules. Final Subcontract Report May 26, 2005 - November 30, 2008.

Ketola, B. M. ; Marinik, B. J.

Technical Information Center Oak Ridge Tennessee

关键词: Photovoltaic cells;    Packaging;    Cost reduction;    Production;    Silicon solar cells;   

RP-ID  :  DE2009958223

学科分类：工程和技术（综合）

美国|英语

来源: National Technical Reports Library

【 摘 要 】

The overall objective of the research effort over its three-phase duration is to develop a reduced-cost, higher-throughput, improved-performance packaging solution for United States Photovoltaic (PV) module manufacturers. The primary target of the work is to develop a packaging solution that will reduce the overall cost contribution of this component by a minimum of 25% relative to the conventional Ethyl Vinyl Acetate (EVA)/ Poly vinyl fluoride (PVF) batch lamination and will provide improved reliability for twenty-plus years of performance in the field. During the subcontract, Dow Corning shall formulate and optimize adhesive, encapsulant, and barrier materials for use with a broad range of current PV technologies. This effort is expected to result in improved performance encapsulation materials and the establishment of a pilot-scale, protection-system production line capable of processing full-size, single-crystalline Silicon PV modules.