Strength of Si Wafers with Microcracks: A Theoretical Model; Preprint.

Rupnowski, P. ; Sopori, B.

Technical Information Center Oak Ridge Tennessee

关键词: Silicon;    Wafers;    Photovoltaic cells;    Defects;    Distribution;   

RP-ID  :  DE2008929625

学科分类：工程和技术（综合）

美国|英语

来源: National Technical Reports Library

【 摘 要 】

This paper concentrates on the modeling of the strength of photovoltaic (PV) wafers. First a multimodal Weibull distribution is presented for the strength of a silicon specimen with bulk, surface, and edge imperfections. Next, a specific case is analyzed of a PV wafer with surface damage that takes the form of subsurface microcracks.