In the past quarter, significant progress has been made in optimize the deposition and release characteristics of ultrathin (less than 4 micron) membranes from rigid silicon substrates. Specifically, we have conducted a series of statistically designed experiments to examine the effects of plasma cleaning and compliant layer deposition conditions on the stress, release and pinhole density of membranes deposited on 4 inch and 6 inch round substrates. With this information we have progressed to the deposition and release of ultra-thin membranes from 12 inch diameter (113 sq. in.) rigid substrates, achieving a key milestone for large-area membrane fabrication. Idatech received and is beginning preparations to test the Pd alloy membranes fabricated at SwRI the previous quarter. They are currently evaluating alternate gasketing methods and support materials that will allow for effective sealing and mounting of such thin membranes. David Edlund has also recently left Idatech and Bill Pledger (Chief Engineer) has replaced him as the primary technical point of contact. At Idetech's request a small number of additional 16 sq. in, samples were provided in a 2 in. by 8 in. geometry for use in a new module design currently under development.
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