NASA Electronic Parts and Packaging (NEPP) Program Status and Technology Investments Overview

Majewicz, Peter ; Pellish, Jonathan ; Sampson, Michael

关键词: ELECTRONIC PACKAGING;    INVENTORY MANAGEMENT;    PACKAGING;    ASSESSMENTS;    ASSURANCE;    EVALUATION;    ELECTROMECHANICAL DEVICES;   

RP-ID  :  GSFC-E-DAA-TN68250

学科分类：电子与电气工程

美国|英语

来源: NASA Technical Reports Server

【 摘 要 】

Overview of agency-level electronic parts management, the NASA Electronic Parts and Packaging (NEPP) Program, and NEPP Program Fiscal Year 2019 task investment areas.